SiLC Technologies Raises $12M in Seed Funding Led by Dell for LiDAR Technology Development

SiLC Technologies, the developer of integrated single-chip FMCW LiDAR solutions, announced that it closed US$12 million in seed funding led by Dell Technologies Capital. Decent Capital, ITIC Ventures, and several prominent angel investors also participated in the funding round. SiLC will use the funding to scale its R&D and operations to develop its frequency modulated continuous wave (FMCW) silicon photonic 4D+ Vision Chip platform.

SiLC demonstrated its integrated FMCW chip and long-range LiDAR resolution at CES 2020. The company also cooperated vehicle lighting supplier Varroc Lighting to exhibit a LiDAR integrated headlamp. Utilizing its second-generation FMCW silicon photonics 4D+ Vision Chip to generate scans, SiLC was able to detect objects smaller than one and a half inches at a range of nearly 200 meters, translating to an effective resolution of around 0.01 degrees vertically and horizontally.

(Image: SiLC)

“Integrating all essential functions necessary to build an FMCW chip on a cost-effective silicon platform represents the holy grail of LiDAR,” said Daniel Docter, Managing Director, Dell Technologies Capital. “SiLC’s team has over twenty years of experience and a proven track record commercializing silicon photonics solutions. After looking at more than 30 different LiDAR companies, we found SiLC to be the only company that has a viable approach for large-scale adoption of LiDAR in automotive and industrial robotics.”

SiLC was founded in 2018 by Mehdi Asghari, who was part of the executive team that led Bookham to its IPO in 2000 and later joined the leadership team at Kotura, which was acquired by Mellanox in 2013. “This is my third startup and by far the most exciting, both at a technology level and the size of the markets it addresses. We believe we have an opportunity to transform several industries,” said Asghari. “Our 4D+ Vision Chip technology will not only make LiDAR a commercial reality but will also enable applications ranging from robotics to AR/VR to biometric scanning.”

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