Comparison of WICOP and product design stolen under the name of COB or CSP
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* Vertical chip: Excellent heat dissipation structure with vertical electrodes design * COB (Chip on Board): A structure that reduces the volume by connecting wires to a semiconductor chip directly mounted on a printed circuit board * CSP (Chip Scale Package): Silicon semiconductor technology that makes BGA (Ball Grid Array) on silicon semiconductor chips and assembles them in a clean room |
Z5M4 LED with WICOP technology is designed to be 1:1 compatible easily with existing high-power products, and its excellent heat dissipation structure makes it a high-power LED package suitable for high-brightness and high-efficiency. It offers an industry-leading high luminous efficiency of 175 lm/W and can be used for up to 100,000 hours.
Seoul Semiconductor has been leading the global market with its core patented technology, which obtained a permanent injunction against Philips TV product and 13 automotive lighting brand LED products infringing WICOP patents in 2019 and 2021.
“Seoul Semiconductor’s Z5M4 LED for high-power lighting will quickly encroach the USD 2 billion market dominated by vertical technology companies. We plan to apply this product not only to the high-power lightings, but also to the electronic device flash and automotive lightings, followed by SunLike LED, a natural sunlight spectrum LED technology,” said an official of Seoul Semiconductor.
Seoul Semiconductor’s Z5M4 package with WICOP technology
About Seoul Semiconductor
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