Expanded capacity of fluorine/nitrogen mixtures
Linde has expanded capacity for fluorine/nitrogen mixtures at Medford, Oregon for etching and chamber cleaning applications.
New precursors to meet customer requirements
New elements of innovation continue to emerge in CVD, ALD, and ALE precursors such as high-volume supply capabilities, process solutions to deliver quality in our advanced precursors and an applications lab to support new materials development. Linde is developing deposition precursors and etch gases: silicon precursors, digermanium mixtures, high K and metal gate precursors, isotope gases and etch gases such as CF3I (trifluoroiodomethane) and custom fluorinated silane.
“Linde recognizes that our customers continue to make investments in new processes and technologies, and we are committed to investing with them for the materials they will require now and in the future,” states Matt Adams, Head of Sales and Marketing for Linde Electronics and Specialty Products.
Linde Electronics will be exhibiting at the SEMICON West tradeshow in San Francisco July 10-12. Its focus will be on the quality, expertise, commitment and environmental leadership that Linde Electronics brings to the semiconductor industry through such offerings as electronic specialty gases, on-site solutions, materials recycling and recovery and SPECTRA® nitrogen plants.
SEMICON West is the annual tradeshow for the micro-electronics manufacturing industry. All visitors are welcome to visit Linde in booth number 5644 in the North hall in the Moscone Center in San Francisco.
Over the past 50 years, Nichia has demonstrated its commitment to improving the overall performance…
To fund the acquisition and ongoing operation of the production facility, BluGlass has secured A$3.4…
New CAS 140D IR spectroradiometer with improved optical and electronic components offer the user higher…
SSC boasts world's only LED and LD technology for vehicles using all wavelengths of light…
E-cars do not have a classic radiator grille, so the front of the vehicle…
“We welcome the further alignment of ANSI C137.4-2021 and D4i, which is expected to lead…