Foldable PeLED and 3D Image Sensing Core Chip Developed by Korean Research Teams

Researchers at the Ulsan National Institute of Science and Technology (UNIST) and the Korea Advanced Institute of Science and Technology (KAIST) have achieved new technology developments including foldable flexible perovskite LEDs and a core chip for 3D image sensors respectively, reported BusinessKorea.

The research team at UNIST announced that it has developed foldable perovskite LEDs (PeLED) with a transparent material as electrode of the device. PeLED uses perovskite material as light emitting layer through electricity. In the study, researchers utilized flexible silver nanowire and conductive polymers in electrodes to replace conventional metal electrode to increase the flexibility of PeLED. Furthermore, the team added polymer electrolytes to enhance electron mobility for improving device performance. The new PeLED can thus achieve 50 percent transparency and remain light emitting with being bended.

The research was published in Nano Letters on January 15.

On the other hand, a research team at KAIST announced its development of a silicon-based optical phased array (OPA) chip for 3D image sensor for applications including autonomous vehicles, drones and robots.

Through collaboration with the National Nanofab Center in South Korea, KAIST developed an ultra-small and low power OPA device which controls the direction of light for scanning. The chip can turn light into a single wavelength light source that can be adjusted in vertical and horizontal direction. Moreover, the small sized chip helps to make 3D image sensor smaller and can further transmit data wirelessly to desired direction.

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