Electronics and Photonics Innovation Center (EPIC) Purchases Palomar 3880 Die Bonder for Expanded Packaging Research

Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Electronics and Photonics Innovation Center (EPIC) has purchased a fully loaded 3880 Die Bonder. The purchase strengthens the continued cooperation between the two entities in the area of photonics and microelectronics packaging research, which began in 2019.

Josef Schmidl, Managing Director EMEA for Palomar Technologies commented, “By acquiring the Palomar 3880 die bonder, EPIC has put their confidence in Palomar and that our equipment provides the highest quality, flexible electronic packaging solutions to support their growing photonics and microelectronics cluster.”

EPIC, founded in 2019, is a center of excellence to support technological innovation and promoting collaborative activity between businesses and research institutions in the area of microelectronics and photonics development. Today, it is home to dozens of leading companies within its facilities and the Torbay Hi-Tech Cluster, a group of internationally recognized companies with renowned expertise in advanced technology research & innovation, developing state of the art hi-tech high value commercial products.

Wayne Loschi, EPIC Centre Director said, “To be able to purchase this capability for EPIC demonstrates our ambitious plans to become a globally recognised centre for photonics and microelectronics. Palomar have been exceptionally supportive and have placed an in-house engineer within the centre to support EPIC tenants. This is an amazing asset to assist the technical needs of our businesses.”