British Micro LED expert Plessey continues to expand partnerships with other industry players to accelerate Micro LED development. The company reported its collaboration with Axus Technology (Axus), a global provider of CMP, wafer thinning and wafer polishing surface-processing solutions for semiconductor applications, to bring high-performance GaN-on-Silicon monolithic Micro LED technology to the mass market.
(Image: Plessey)
Plessey continues to invest heavily in its manufacturing facility to boost Micro LED display capabilities with the purchase of metal and oxide chemical mechanical polishing (CMP) and associated tools from Axus to enable the wafer-scale bonding of Micro LED wafers to high-performance CMOS backplanes.
With the tools from Axus, Plessey achieved the world’s first functional wafer-level bonded GaN-on-Si monolithic 1080p 0.7-inch Micro LED active-matrix display with 8µm pixel-pitch. Plessey further optimized these systems and processes to achieve a wafer to wafer bond of a 0.26-inch monochrome native Green 1080p Micro LED display to a 3µm pixel-pitch backplane display system engineered by Compound Photonics, creating over two million individual electrical bonds.
(Electrically and mechanically bonded Micro LED array wafer to 3µm pixel pitch backplane; image: Plessey)
The formation of the Plessey/Axus partnership has led to the development of critical CMP processes for various materials key to enabling Plessey’s proprietary monolithic GaN-on-Si technology. Engineers from both companies have collaborated to successfully accomplish these objectives at both Axus’ CMP foundry located in Chandler, Arizona and Plessey’s semiconductor fabrication facility in the United Kingdom.
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