sdavis, Author at Variance Lighting • Page 27 of 44

Boron nitride separation process could facilitate higher efficiency solar cells

By sdavis October 7, 2018Blog

A team of semiconductor researchers based in France has used a boron nitride separation layer to grow indium gallium nitride (InGaN) solar cells that were then lifted off their original…

Overcoming challenges of futuristic transistor technology below 5nm node

By sdavis October 6, 2018Blog

To scale down a transistor below a 5nm node is one of the vital concerns for VLSI industry as there are various challenges due to the shrinking of components. Several…

Part-organic invention can be used in bendable mobile phones

By sdavis October 6, 2018Blog

Engineers at The Australian National University (ANU) have invented a semiconductor with organic and inorganic materials that can convert electricity into light very efficiently, and it is thin and flexible…

Synopsys Design Platform enabled for TSMC’s multi-die 3D-IC advanced packaging technologies

By sdavis October 6, 2018Blog

Synopsys, Inc. (Nasdaq: SNPS) today announced the Synopsys Design Platform fully supports TSMC’s wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS®) advanced packaging technologies. The design platform enablement, combined with the…

INFICON acquires Final Phase Systems

By sdavis October 5, 2018Blog

On October 1, 2018 INFICON Inc. (SWX:IFCN), a supplier of vacuum instrumentation and process control software to the semiconductor manufacturing industry acquired all assets of Final Phase Systems (FPS) of…

AIM Photonics unveils support for datacom and telecom optical bands with its new silicon photonics PDK

By sdavis October 5, 2018Blog

The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) today announced the release of the AP SUNY Process Design Kit v2.5a (APSUNY_PDKv2.5a). In this latest release,…

CMOS image sensors: Yole Développement is increasing its forecasts again

By sdavis October 4, 2018Blog

“2017 was an excellent year for CIS , with growth observed in all segments except computing,” commented Pierre Cambou, Principal Analyst, Technology & Market, Imaging at Yole Développement (Yole). Driven…

DRAM market braces for slower growth

By sdavis October 4, 2018Blog

In its September Update to The 2018 McClean Report, IC Insights discloses that over the past two years, DRAM manufacturers have been operating their memory fabs at nearly full capacity,…

ANSYS achieves TSMC certifications for 7nm FinFET plus process technology and integrated fan-out with memory on substrate advanced packaging technology

By sdavis October 3, 2018Blog

ANSYS (NASDAQ: ANSS) announced TSMC certified ANSYS solutions for the 7 nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the…

Global semiconductor sales increase 14.9% year-to-year in August

By sdavis October 3, 2018Blog

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, to day announced worldwide sales of semiconductors reached $40.16 billion for the month of August 2018,…