Zips on the nanoscale
Nanostructures based on carbon are promising materials for nanoelectronics. However, to be suitable, they would often need to be formed on non-metallic surfaces, which has been a challenge – up…
French start-up moves to the edge with battery-operated devices
By Serena Brischetto The SEMI Europe Industry Strategy Symposium (ISS Europe) returns in Milan, Italy, this year from 31st March to 2nd April, 2019 to explore new opportunities and challenges…
Cadence CMP Process Optimizer enables Toshiba Memory to accelerate delivery of advanced 3D Flash memory devices
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Toshiba Memory Corporation has successfully used the Cadence® CMP Process Optimizer, a model calibration and prediction tool that accurately simulates multi-layer…
North American semiconductor equipment industry posts January 2019 billings
North America-based manufacturers of semiconductor equipment posted $1.89 billion in billings worldwide in January 2019 (three-month average basis), according to the January Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The…
GOWIN Semiconductor announces release of the new GOWIN EDA tools for improved performance on new FPGA product families
GOWIN Semiconductor Corp., an innovator of programmable logic devices, announces the release of GOWIN’s new EDA tool, YunYuan 1.9. With the release of this new toolchain, GOWIN will enable enhanced…
pSemi announces Sumit Tomar will be transitioning to CEO
pSemi Corporation today announced that its parent company and executive leadership has approved the recommendation of Chairman and Chief Executive Officer Jim Cable for an evolution of the company’s senior…
ESI receives significant Asia order for flex PCB laser via drilling solution
Electro Scientific Industries (ESI), a division of MKS Instruments, Inc. (NASDAQ:MKSI) and an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced an order for its recently-released CapStone…
eSilicon builds momentum as a strong tier one FinFET ASIC supplier
eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company’s growth in the tier one FinFET…
UltraSoC extends on-chip analytics architecture for the age of machine learning, artificial intelligence and parallel computing
UltraSoC today announced a significant extension of its embedded analytics architecture, allowing designers and innovators to incorporate powerful data-driven features into their products. Developers in the automotive, storage and high…
Chemical data mining boosts search for new organic semiconductors
Organic semiconductors are lightweight, flexible and easy to manufacture. But they often fail to meet expectations regarding efficiency and stability. Researchers at the Technical University of Munich (TUM) are now…