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GLOBALFOUNDRIES, indie Semiconductor deliver performance-enhanced microcontrollers for automotive applications

Posted by By sdavis November 13, 2018Posted inBlog
GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF’s 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash®) technology.…
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IHP cooperates with EV Group on low-temperature covalent wafer bonding

IHP cooperates with EV Group on low-temperature covalent wafer bonding

Posted by By sdavis November 12, 2018Posted inBlog
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High Performance Microelectronics (IHP), a…
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Veeco and ALLOS technical collaboration accelerates the pace for 200mm GaN-on-Silicon microLED applications

Posted by By sdavis November 11, 2018Posted inBlog
Veeco Instruments Inc. (Nasdaq: VECO) and ALLOS Semiconductors GmbH announced today the completion of another phase of their mutual effort to provide the industry with leading GaN-on-Silicon epiwafer technology for…
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MRSI announces HVM3 die bonding demonstration capability in Shenzhen China

Posted by By sdavis November 10, 2018Posted inBlog
MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations…
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Unlocking the secrets of metal-insulator transitions

Posted by By sdavis November 10, 2018Posted inBlog
By using an x-ray technique available at the National Synchrotron Light Source II (NSLS-II), scientists found that the metal-insulator transition in the correlated material magnetite is a two-step process. The…
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Foldable AMOLED panel shipments to top 50M units by 2025

Foldable AMOLED panel shipments to top 50M units by 2025

Posted by By sdavis November 10, 2018Posted inBlog
Spurred on by growing demand for innovative user experience in smartphones, shipments of foldable active-matrix organic light-emitting diode (AMOLED) panels are expected to reach 50 million units by 2025 for…
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Toyoda Gosei to launch corporate venture capital

Posted by By sdavis November 9, 2018Posted inBlog
Toyoda Gosei Co., Ltd. will establish a Corporate Venture Capital Department in January 2019. This new department will serve as the company’s center for flexible and swift investment in startups…
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Semiconductor Research Corporation welcomes SK hynix to its acclaimed GRC and NST research programs

Posted by By sdavis November 9, 2018Posted inBlog
Semiconductor Research Corporation (SRC), today announced that SK hynix, a global leader in producing semiconductors including DRAM and NAND Flash memory, has signed an agreement to join SRC’s research consortium.…
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SEMI supports U.S. return to trade talks with China, issues trade negotiation principles

Posted by By sdavis November 9, 2018Posted inBlog
SEMI, the global industry association serving the electronics manufacturing supply chain, today voiced support and encouragement for trade discussions between U.S. President Donald Trump and People’s Republic of China President…
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Entegris expands clean manufacturing facility in Malaysia

Posted by By sdavis November 8, 2018Posted inBlog
Entegris Inc. (Nasdaq: ENTG) announced today the grand opening of its expanded, state-of-the-art clean manufacturing facility in Kulim, Malaysia. With a $30M USD investment, Entegris has increased the manufacturing capacity…
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