Posts by sdavis

IBM (NYSE:  IBM) today announced an agreement with Samsung to manufacture 7-nanometer (nm) microprocessors for IBM Power Systems, IBM Z and LinuxONE, high-performance computing (HPC) systems, and cloud offerings. The…

A research study on low noise and high-performance transistors led by Suprem Das, assistant professor of industrial and manufacturing systems engineering, in collaboration with researchers at Purdue University, was recently…

Flexible and printed electronics innovations and autonomous mobility sensors will take center stage as more than 700 attendees gather for 120 market and technical presentations, 70 exhibits and four short…

A team of researchers at the New York University Tandon School of Engineering and NYU Center for Neural Science has solved a longstanding puzzle of how to build ultra-sensitive, ultra-small…

GIGAPHOTON Inc., a manufacturer of light sources used in semiconductor lithography, announced that following the high level of response to its initial March 2018 announcement of “FABSCAPE™” for the operational…

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM)…

Micron Technology, Inc., (Nasdaq: MU) a developer of memory and storage solutions, today announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use…

ClassOne Technology, global supplier of wet processing equipment for ≤200mm semiconductor manufacturing, announced the sale of three more tools to the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) in Berlin, Germany. In recent…