Honoring Bill Tobey
I have some sad news to share. Industry pioneer and legend Aubrey “Bill” Tobey passed away on March 1st. He was a good friend and a great supporter of The…
CEA-Leti & Dolphin Design Report FD-SOI Breakthrough
CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated in the digital design flow with industrial-grade qualification, overcoming integration drawbacks…
How Will A Post-Covid World Affect Users Of Memory Technology?
By Johnson Chen, Winbond Electronics Corporation It’s has been more than one year into the Covid-19 pandemic, and the strict guidelines that were once deemed temporary in order to control…
Kuprion Introduces ActiveCopper Filled Thermal Vias
Kuprion, Inc., a spinout of Lockheed Martin, introduced ActiveCopper Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex,…
Outlook for 2021: Executive Viewpoints
Each year, Semiconductor Digest turns to industry leaders and analysts to get their viewpoints on what they expect to see in the coming year in terms of critical tech and…
No Security, No Safety – Semiconductor Digest
In a new webinar, Winbond’s Hung-Wei Chen provided an overview of today’s top cybersecurity threats and regulations, and detailed the company’s TrustME solutions for flash memory. In what he described…